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Contribution of Copper Ion Resistance to Survival of Escherichia coli on Metallic Copper Surfaces▿

机译:铜离子抗性对金属铜表面上大肠杆菌存活的贡献▿

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摘要

Bacterial contamination of touch surfaces poses a serious threat for public health. The use of bactericidal surface materials, such as copper and its alloys, might constitute a way to aid the use of antibiotics and disinfectants, thus minimizing the risk of emergence and spread of multiresistant germs. The survival of Escherichia coli on metallic copper surfaces has been studied previously; however, the mechanisms underlying bacterial inactivation on copper surfaces have not been elucidated. Data presented in this study suggest that bacteria are killed rapidly on dry copper surfaces. Several factors, such as copper ion toxicity, copper chelators, cold, osmotic stress, and reactive oxygen species, but not anaerobiosis, influenced killing rates. Strains deleted in copper detoxification systems were slightly more sensitive than was the wild type. Preadaptation to copper enhanced survival rates upon copper surface exposure. This study constitutes a first step toward understanding the reasons for metallic copper surface-mediated killing of bacteria.
机译:触摸表面的细菌污染严重威胁公共健康。使用诸如铜及其合金之类的杀菌表面材料可能构成辅助使用抗生素和消毒剂的方法,从而将多重耐药菌出现和传播的风险降到最低。先前已经研究了大肠杆菌在金属铜表面上的存活;然而,尚未阐明铜表面细菌灭活的潜在机制。这项研究中提供的数据表明细菌在干燥的铜表面上被迅速杀死。诸如铜离子毒性,铜螯合剂,冷,渗透压和活性氧等多种因素影响了杀灭率,但没有厌氧菌。在铜排毒系统中删除的菌株比野生型敏感。铜的重新适应提高了铜表面暴露后的存活率。这项研究是了解金属铜表面介导的细菌杀灭原因的第一步。

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